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Electronic Materials
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Dry Film Photoresist
Photoimageable Coverlay
Flexible Copper Clay Laminates
FSTEM has developed a next-generation water-soluble dry film photoresist to meet evolving demands in PCB/FPC industries. Compared to conventional products, it delivers high resolution, superior adhesion, low odor, and residue-free performance, effectively improving production yield, reducing environmental pollution, and offering outstanding environmental and economic benefits.
FPC Dry Film Photoresist
Semi-LDI Dry Film Photoresist
LDI Dry Film Photoresist
Dry Film Photoresist for IC Substrate Packaging
FPC Dry Film Photoresist
These Dry Film Photoresist(DFR)are aqueous processable photosensitive film newly developed for FPC, which are excellent in adhesion, resolution and stripping property.
Main Characteristics Of FPC Dry Film Photoresist
High sensitivity
High resolution
Excellent adhesion
Fast stripping
Residue-free development
Wide processing window
Performance
Series
Thickness(mil)
Features
FE-5200
0.8/1.0/1.2
Compatible with Wet Lamination ProcessCommon Dry Film Photoresist
FE-5300
0.8/1.0/1.2/1.5
High Resolution & Filling CapacityOptimized for Rigid-Flex Boards
FA-1100
0.8/1.0/1.2
High Resolution and Superior Adhesion
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